Xavier Baraton : rechercher sur Z-Library

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1

Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications

Tong Yan Tee, Hun Shen Ng, Daniel Yap, Xavier Baraton, Zhaowei Zhong

Journal:

Microelectronics Reliability

Année:

2003

Langue:

english

Fichier:

PDF, 283 KB

english, 2003

2

Interface delamination analysis of TQFP package during solder reflow

Hu Guojun, Roberto Rossi, Luan Jing-En, Xavier Baraton

Journal:

Microelectronics Reliability

Année:

2010

Langue:

english

Fichier:

PDF, 722 KB

english, 2010

3

Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill

Tong Yan Tee, Chek Lim Kho, Daniel Yap, Carol Toh, Xavier Baraton, Zhaowei Zhong

Journal:

Microelectronics Reliability

Année:

2003

Langue:

english

Fichier:

PDF, 424 KB

english, 2003

4

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Development and characterization of next generation eWLB (embedded Wafer Level BGA) packaging

Jin, Yonggang, Teysseyre, Jerome, Baraton, Xavier, Yoon, S. W., Lin, Yaojian, Marimuthu, Pandi C.

Année:

2012

Langue:

english

Fichier:

PDF, 893 KB

english, 2012

5

[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - Next generation eWLB (embedded wafer level BGA) packaging

Yonggang Jin,, Baraton, Xavier, Yoon, S. W., Lin, Yaojian, Marimuthu, Pandi C., Ganesh, V. P., Meyer, Thorsten, Bahr, Andreas

Année:

2010

Langue:

english

Fichier:

PDF, 1.63 MB

english, 2010

6

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Mechanical characterization of next generation eWLB (embedded wafer level BGA) packaging

Yoon, S. W., Lin, Yaojian, Gaurav, Sharma, Jin, Yonggang, Ganesh, V. P., Meyer, Thorsten, Marimuthu, Pandi C., Baraton, Xavier, Bahr, Andreas

Année:

2011

Langue:

english

Fichier:

PDF, 1.27 MB

english, 2011

7

[IEEE 2010 34th International Electronics Manufacturing Technology Conference (IEMT) - Melaka, Malaysia (2010.11.30-2010.12.2)] 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) - Packaging trends in mobile electronics - Towards wafer level packaging

Baraton, Xavier

Année:

2010

Langue:

english

Fichier:

PDF, 93 KB

english, 2010

8

[IEEE 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Penang, Malaysia (2008.11.4-2008.11.6)] 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Characterization of silicon die strength with application to die crack analysis

Hu Guojun,, Luan Jing-en,, Baraton, Xavier

Année:

2008

Langue:

english

Fichier:

PDF, 262 KB

english, 2008

9

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Development of advanced fan-out wafer level package (embedded Wafer Level BGA) packaging

Jin, Yonggang, Teysseyre, Jerome, Baraton, Xavier, Yoon, S.W., Lin, Yaojian, Marimuthu, Pandi C.

Année:

2012

Langue:

english

Fichier:

PDF, 1.86 MB

english, 2012

10

[IEEE 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Penang, Malaysia (2008.11.4-2008.11.6)] 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Thermal cycling fatigue model development for FBGA assembly with Sn-Ag-based lead-free solder

Che, Fa-Xing, Luan, Jing-En, Yap, Daniel, Goh, Kim-Yong, Baraton, Xavier

Année:

2008

Langue:

english

Fichier:

PDF, 322 KB

english, 2008

11

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Camera Module Design, Assembly and Test Challenges

Luan, Jing-en, Baraton, Xavier, Wong, Wingshenq, Goh, Kim-yong, Yap, Daniel

Année:

2008

Langue:

english

Fichier:

PDF, 6.33 MB

english, 2008

12

[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Drop impact life model development for FBGA assembly with lead-free solder joint

Che, Faxing, Luan, Jing-En, Goh, Kim Yong, Baraton, Xavier

Année:

2009

Langue:

english

Fichier:

PDF, 1.25 MB

english, 2009

13

[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Analysis of interfacial delamination in IC packaging: Use stress or fracture mechanics?

Guojun, Hu, Jing-en, Luan, Baraton, Xavier, Tay, Andrew A. O.

Année:

2009

Langue:

english

Fichier:

PDF, 769 KB

english, 2009

14

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - A novel methodology for virtual qualification of IC packages under board level drop test

Luan, Jing-en, Goh, Kim-yong, Baraton, Xavier, Hussa, Esa

Année:

2008

Langue:

english

Fichier:

PDF, 959 KB

english, 2008

15

[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Advanced packaging solutions of next generation eWLB technology

Yonggang Jin,, Teysseyrex, Jerome, Baraton, Xavier, Yoon, S. W., Yaojian Lin,, Marimuthu, Pandi C.

Année:

2011

Langue:

english

Fichier:

PDF, 1.34 MB

english, 2011

16

[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Challenges for extra large embedded wafer level ball grid array development

Luan, Jing-en, Jin, Yonggang, Goh, Kim-yong, Ma, Yiyi, Hu, Guojun, Huang, Yaohuang, Baraton, Xavier

Année:

2009

Langue:

english

Fichier:

PDF, 2.26 MB

english, 2009

17

SPIE Proceedings [SPIE SPIE NanoScience + Engineering - San Diego, CA (Sunday 2 August 2009)] Carbon Nanotubes, Graphene, and Associated Devices II - Growth of graphene films by plasma enhanced chemical vapour deposition

Baraton, Laurent, Gangloff, Laurent, Xavier, Stéphane, Cojocaru, Costel S., Huc, Vincent, Legagneux, Pierre, Lee, Young Hee, Pribat, Didier, Razeghi, Manijeh, Pribat, Didier, Lee, Young-Hee

Année:

2009

Langue:

english

Fichier:

PDF, 1.21 MB

english, 2009

18

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Effect of silver content and nickel dopant on mechanical properties of Sn-Ag-based solders

Che, F.X., Luan, J.E., Baraton, Xavier

Année:

2008

Langue:

english

Fichier:

PDF, 473 KB

english, 2008